GPC Showcases AI + AOI and Advanced Packaging at SEMICON Taiwan 2025

GPC is driving its transformation from semiconductor back-end expertise to a leading system integrator (SI). With “AOI + AI deep learning” delivering smarter automated inspection and a strong focus on advanced packaging (CoWoS) yield solutions, the company presents a clear path for data-driven smart manufacturing.

Recognized with the 2024 TITL Best Supplier Award (RSRA), GPC continues to strengthen global trust through process optimization and system integration excellence.

Visit us at SEMICON Taiwan, September 10–12, 2025, Booth P5908, Taipei Nangang Exhibition Center.

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